PCBA Process

Our company has introduced 6 production lines for Yamaha high-speed SMT SMT mounting equipment, with a daily mount of 10 million points and a mounting accuracy of ± 0.025mm. It can mount 0201 packaging and BGA packaging components, and the mounting accuracy meets the requirements of high-precision products. The minimum line width/line spacing for chip mounting is 4mil. The quality inspection department is equipped with high-precision testing equipment such as push and pull gauges, tension testers, optical microscopes, high-power electron microscopes, digital bridges, SPI, AOI, X-RAY, etc. Can meet the production and processing requirements of various precision electronic products for customers.

Monthly production capacity of process capacity: 25000 square meters (multi-layer board)

Number of floors: 2-42

Product type: HDI board, high-frequency board, RF board, impedance board, thick copper board (7 OZ), soft and hard combination board, yin and yang copper board, aluminum substrate, mixed pressure plate, back board, buried capacitance buried resistance board

raw material:

Conventional board: FR4 (Shengyi S1141) KB (Jiantao)

High frequency materials: Rogers, Taconic, Arlon

High TG board: S1000-2M, Lianmao IT180A and supporting P sheets

Halogen-free board: Shengyi S1155, S1165 series

Soldering resistance: Sun ink (Japan Taiyo PSR-2000/4000 series)

Chemical solution: Anmet browning solution (MS300), Rohm Haas electroplating solution (125T, EP1000), etc

Surface treatment: tin spraying, lead-free tin spraying, gold precipitation, OSP, tin precipitation, silver precipitation, hard gold plating (50u ")

Selective surface treatment: sinking gold+OSP, sinking gold+gold fingers, sinking silver+gold fingers, sinking tin+gold fingers

Technical parameters:

Minimum line width/spacing: outer layer 2.0/2.0mil (completed copper thickness 30um), inner layer 2.5/2.5mil (1/3, 1/2OZ)

Minimum drilling: 0.10mm (mechanical drilling)/3mil (laser drilling)

Minimum welding ring: 4mil

Minimum interlayer thickness: 2mil

Thickest copper thickness: 7 OZ

Maximum size of finished product: 600x800mm

Board thickness: double-sided board 0.2-7.0mm, multi-layer board 0.4-7.0mm

Resistance welding bridge: ≥ 0.08mm

Plate thickness to aperture ratio: 26:1

Plug hole capacity: 0.2-0.8mm

Tolerance:

Metallized hole: ± 0.075mm (limit ± 0.05)

Non metallic hole: ± 0.05mm (limit+0/-0.05mm or+0.05/-0mm)

Appearance tolerance: ± 0.1mm (limit ± 0.05-0.075mm)

Functional testing:

Insulation resistance: 50 ohms (normal)

Peel strength: 1.4N/mm

Thermal stress test: 280 ℃, 20 seconds

Resistance welding hardness: ≥ 6H

Electrical measurement voltage: 10V-250V

Warpage degree: ≤ 0.7%