Monthly production capacity of process capacity: 25000 square meters (multi-layer board)
Number of floors: 2-42
Product type: HDI board, high-frequency board, RF board, impedance board, thick copper board (7 OZ), soft and hard combination board, yin and yang copper board, aluminum substrate, mixed pressure plate, back board, buried capacitance buried resistance board
raw material:
Conventional board: FR4 (Shengyi S1141) KB (Jiantao)
High frequency materials: Rogers, Taconic, Arlon
High TG board: S1000-2M, Lianmao IT180A and supporting P sheets
Halogen-free board: Shengyi S1155, S1165 series
Soldering resistance: Sun ink (Japan Taiyo PSR-2000/4000 series)
Chemical solution: Anmet browning solution (MS300), Rohm Haas electroplating solution (125T, EP1000), etc
Surface treatment: tin spraying, lead-free tin spraying, gold precipitation, OSP, tin precipitation, silver precipitation, hard gold plating (50u ")
Selective surface treatment: sinking gold+OSP, sinking gold+gold fingers, sinking silver+gold fingers, sinking tin+gold fingers
Technical parameters:
Minimum line width/spacing: outer layer 2.0/2.0mil (completed copper thickness 30um), inner layer 2.5/2.5mil (1/3, 1/2OZ)
Minimum drilling: 0.10mm (mechanical drilling)/3mil (laser drilling)
Minimum welding ring: 4mil
Minimum interlayer thickness: 2mil
Thickest copper thickness: 7 OZ
Maximum size of finished product: 600x800mm
Board thickness: double-sided board 0.2-7.0mm, multi-layer board 0.4-7.0mm
Resistance welding bridge: ≥ 0.08mm
Plate thickness to aperture ratio: 26:1
Plug hole capacity: 0.2-0.8mm
Tolerance:
Metallized hole: ± 0.075mm (limit ± 0.05)
Non metallic hole: ± 0.05mm (limit+0/-0.05mm or+0.05/-0mm)
Appearance tolerance: ± 0.1mm (limit ± 0.05-0.075mm)
Functional testing:
Insulation resistance: 50 ohms (normal)
Peel strength: 1.4N/mm
Thermal stress test: 280 ℃, 20 seconds
Resistance welding hardness: ≥ 6H
Electrical measurement voltage: 10V-250V
Warpage degree: ≤ 0.7%